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Gap Pad sheet-type thermal interface material
At Henkel, we have developed and provide the BERGQUIST GAP PAD series, a sheet-type interface material that is easy to install and has high thermal performance for thermal management of electronic components and substrates.
![[Research Material] Global Market for Electronic Thermal Interface Materials](https://image.mono.ipros.com/public/product/image/df3/2001472156/IPROS86661273759064144306.jpeg?w=280&h=280)
Global Market for Electronic Thermal Interface Materials: Silicone Gaskets, Graphite Pads, Thermal Conductive Pastes, Thermal Conductive Adhesive Tapes ...
This research report (Global Electronic Thermal Interface Materials Market) investigates and analyzes the current state and outlook for the global market of electronic thermal interface materials over the next five years. It includes information on the overview of the global electronic thermal interface materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis, among other details. The segments by type in the electronic thermal interface materials market include silicone gaskets, graphite pads, thermal conductive pastes, thermal conductive adhesive tapes, thermal conductive films, phase change materials, and others. The segments by application cover the LED industry, computer industry, energy industry, telecommunications industry, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of electronic thermal interface materials. The market share of major companies in the electronic thermal interface materials sector, product and business...
